
BGA Test and Technology
Testing & Semi-Conductor Processing Service 116 Wilbur Place BohemiaBohemia, NY
11716 http://bgatechnology.com 631-750-4600 sales@bgatechnology.com
- John Bonlarron
- mdenaro@bgatechnology.com
About BGA Test and Technology
BGA Test & Technology is at the forefront of Robotic Hot Solder Dip (RHSD) and Re balling technologies. Our RHSD processes meets the requirements of GEIA-STD-0006. BGA Test & Technology’s Re balling standard meets Aerospace , Defense and High Performance Electronic industries requirement. Our Process and Quality System (AS9100D) have been audited and approved by many Aerospace & Defense OEM’s and CEM’s. Our innovative system allows us to provide a cost effective, high quality and quick turn around solution. We have made investment in the latest technology and equipment. Our facility ( Temp & Humidity Controlled) meets all of our customers needs.
Our Services
- Ball Grid Array Re-balling/Repair Solutions – Tin Whisker Mitigation
- Robotic Hot Solder Dip (RHSD) – Tin Whisker Mitigation
- Gold Embrittlement Mitigation
- Electrical Testing & Temperature Up-Screening