About BGA Test and Technology

BGA Test & Technology is at the forefront of Robotic Hot Solder Dip (RHSD) and Re balling technologies. Our RHSD processes meets the requirements of GEIA-STD-0006. BGA Test & Technology’s  Re balling standard meets Aerospace , Defense and High Performance Electronic industries requirement. Our Process and Quality System (AS9100D) have been audited and approved by many Aerospace & Defense  OEM’s and CEM’s.  Our innovative system allows us to provide a cost effective, high quality and quick turn around solution. We have made investment in the latest technology and equipment. Our facility  ( Temp & Humidity Controlled) meets all of our customers needs.

Our Services

• Ball Grid Array Re-balling/Repair Solutions – Tin Whisker Mitigation
• Robotic Hot Solder Dip (RHSD) – Tin Whisker Mitigation
• Gold Embrittlement Mitigation
• Electrical Testing & Temperature Up-Screening